Researchers from the Florida Institute for Cybersecurity (FICS) at the University of Florida published this technical paper titled “FICS PCB X-ray: A dataset for automated printed circuit board ...

Has 3-D X-ray PCB assembly inspection finally become a mainstream, inline production tool? The answer ranges from “it has been for some time” to “almost” and clearly depends on whom you ask. There are ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...