Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

A new systems design toolset aims to create a unified user experience for board designers while adding cloud connectivity and artificial intelligence (AI) capabilities, which will enable engineers to ...

Announces Synopsys.ai customer momentum with applications including DSO.ai and VSO.ai delivering significant improvements in PPA, turn-around time, and more; Drives multi-die design innovation with ...

Cadence is a leader in EDA and is increasingly focused on digital and AI applications and implementations. Excellent design, simulation, and verification functionality, locked-in customers, and ...