"Single Lane - SPC Statistical Process Control - Germany IDS 5.3M Pixel -Machine Customisation is available 3D SPI Specification: Model EKT-8060A Board Handling PCB Size Min: 55*55mm – Max: 400*350mm ...

Test Research of Taiwan has revealed its latest automatic solder paste inspection machine using 3D vision, that can also inspect bumps, flux, mini LEDs and bare boards. Called TR7007Q SII it has a ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

The use of AOI (automated optical inspection) systems with dual-lane configurations is increasing in high-speed PCB (printed-circuit board) assembly, due to the systems’ ability to double capacity in ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...