Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

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The Fabric Manager software package has been unleashed for emerging InfiniBand designs. Using this software package, design engineers can manage the flowof data through fabrics connecting remote ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Packaging often stands as the first physical point of contact between a brand and its audience. While often overlooked or treated as an afterthought, package design reflects a brand’s attention to ...