A new process combines two well-known bonding methods, edge folding and ultrasonic welding, to create an optimized procedure for joining decorative materials like vinyl, textiles, or leather to a ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

(Nanowerk News) Electronic waste, or e-waste, is a rapidly growing global problem, and it’s expected to worsen with the production of new kinds of flexible electronics for robotics, wearable devices, ...

In a study published in RSC: Applied Polymers, Thomas J. Wallin of MIT, Chen Wang of the University of Utah, and seven other researchers introduced a novel flexible substrate material. This material ...

Tel Aviv–based UBQ Materials announced today a partnership with Polymertal, a developer of hybrid plastic-metal parts headquartered in Haifa, Israel. Polymertal will use UBQ’s sustainable ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.