CPS Technologies offers aluminum-silicon-carbide (AlSiC) metal-matrix composite pin-fin substrates for liquid-cooled high-power module systems used in hybrid electric vehicle (HEV) applications.

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.