Raytheon has just announced a new $20 million contract through its Strategic and Spectrum Missions Advanced Resilient Trusted Systems (SSMARTS) consortium to develop a next-gen, multi-chip package ...

COSTA MESA, Calif., May 16, 2024 /PRNewswire/ -- Viking Technology, a division of Sanmina Corporation (SANM), announces their newly released 16GB DDR4 Multi-Chip Package (MCP). This high-density MCP ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Raytheon’s new $20 million contract to develop a multichip package for use in airborne, maritime and ground sensors comes amid a broader push to strengthen the defense industrial base. Credit: Alamy ...

In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...

Intel announced delivery of the first multi-chip package (MCP) prototypes created under the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program. Awarded the U.S. Department of Defense ...

ARLINGTON, Va., Feb. 1, 2024 /PRNewswire/ -- Raytheon, an RTX (RTX) (NYSE: RTX) business, has been awarded a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted ...

Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...

Intel Corporation INTC recently delivered cutting-edge multi-chip package (MCP) prototypes to support the DoD’s (Department of Defense) mission to modernize and enhance the defense industrial base’s ...

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...

Toshiba Corp. has developed a stacked multi-chip package (MCP) that is about 30 percent smaller than its smallest current MCP, providing potential benefits for new mobile handsets, the company ...