SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
Explosive growth of generative artificial intelligence (AI) applications in recent quarters has spurred demand for AI servers and skyrocketing demand for AI processors. Most of these processors — ...
What are the current challenges involved with incorporating sufficient HBM into multi-die design? How a new interconnect technology can address the performance, size, and power issues that could ...
Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
With the goal of increasing system performance per watt, the semiconductor industry is always seeking innovative solutions that go beyond the usual approaches of increasing memory capacity and data ...
- SK hynix 32Gb 1b die-based 256GB server DDR5 RDIMM completes compatibility validation with Intel Xeon 6 platform - ...
TL;DR: SK hynix unveiled next-gen HBM4 memory with up to 16-Hi stacks, 48GB capacity, and 2TB/sec bandwidth, targeting NVIDIA's Vera Rubin AI GPUs in 2026. Mass production begins in late 2025, ...
To cope with the memory bottlenecks encountered in AI training, high performance computing (HPC), and other demanding applications, the industry has been eagerly awaiting the next generation of HBM ...
The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on ...
High-bandwidth memory (HBM) is an important part of AI processors, handling massive data processing and computations. In response, Teradyne, Inc. has launched the Magnum 7H, a next-generation memory ...
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