Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal expansion ...

TSMC's demand for CoWoS chipmaking materials has become so great that it is causing material shortages in the memory market. Mitsubishi Gas Chemical has announced to clients that shipments of raw ...

Nvidia's high-end AI server, the GB200, is facing challenges due to technical bottlenecks and material supply issues. Industry sources report that key materials used for chip substrates are in short ...

TSMC’s (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI chips. The production capacity of CoWoS ...

TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s ...

Click to share on X (Opens in new window) X Click to share on Facebook (Opens in new window) Facebook Nvidia’s use of TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging for its new Blackwell platform ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...

TSMC first developed its CoWoS package for advanced chips in 2012 and combined with HBM in 2016. The explosion of generative AI technology such as ChatGPT has been a catalyst for growth of TSMC’s ...

Despite market speculation of a major reduction in Nvidia Corporation's (NASDAQ:NVDA) 2025 Chip-On-Wafer-On-Substrate (CoWoS) wafer orders at Taiwan Semiconductor Manufacturing Co (NYSE:TSM), renowned ...

Amsterdam, The Netherlands: TSMC recently demonstrated two foundry-first reference flows that support 20nm and CoWoS (Chip on Wafer on Substrate) technologies. The 20nm reference flow enables 20nm ...

Yesterday, TSMC announced the first successful production of a 32-core ARM chip based on 16nm FinFET technology. According to the foundry, it collaborated with HiSilicon technologies to create the ...